Rugged Systems

Abaco Systems was among the first companies to bring to market commercial off-the-shelf (COTS) products that were rugged by design–as opposed to commercial products that were ruggedized as an afterthought.

Created to operate in the harshest of environments, our products now reflect our unparalleled experience and expertise in creating truly rugged solutions, with our unique combination of design evaluation and assembly and test practices through to advanced thermal management, mechanical engineering and hermetic control techniques.

We make our products rugged by upgrading or screening parts for extended temperatures, adding mechanical stiffening bars, and/or changing substrate materials for thermal conduction. An integrated stiffening frame/thermal management assembly is used to optimize the mechanical dynamic and thermal performance. A variety of conformal coatings are available for humidity and static control.

 

 

 

You can choose from five levels of ruggedization for maximum cost-effectiveness, with 100% application portability from benign to conduction-cooled.

 

 

Knowing that our products will be deployed in a wide range of harsh military, aerospace and industrial environments, we offer five distinct ruggedization levels. Development systems are compatible and interoperable with deployed systems through the use of shared circuit design and software compatibility, allowing the most cost-effective option to be selected. Each of the five levels differs only in the mechanical build standard, type of cooling and the quality of the electronic components used.

Our five rugged levels offer increasing levels of environmental durability, enabling operational goals to be met at the lowest possible cost. Each rugged level has been carefully tailored to provide the optimal trade-off between cost, performance and reliability. Selection will depend on the type of cooling required–either forced air or by conduction – and the overall requirements for environmental performance.

Fully compliant with the ANSI/VITA 1-1994 VMEbus and IEEE Std 1101.2-1992 conduction-cooled specifications, our products can be used with complete confidence in conjunction with both in-house designs and other vendor products that meet the same internationally recognized standards.

 

 

 

Our experience, expertise and patented technologies in cooling don’t just deliver maximum reliability – they allow components to operate at maximum capacity, providing superior performance.

 

 

Advances in processor technologies not only result in increasing power consumption, but also, as device geometries decrease, losses due to leakage currents increase while the surface area of the die from which heat must be extracted decreases. This leads to a need to continually innovate in techniques for extracting heat from devices, boards and systems.

Abaco Systems is uniquely placed to advance the state of the art in thermal management techniques. Advances come from both internal and external research, such as DARPA contracts. By working on leading edge technologies such as Thermal Ground Planes and Near Junction Cooling of devices as research programs, then transitioning them to deployable implementations, higher power devices can be deployed and junction temperatures can be reduced, leading to better reliability and mean time before failure.

Our engineers take a holistic approach to thermal engineering of a system. We address issues at every stage of heat extraction from the device level, through the board assembly and heatsinking, the thermal interface to the chassis and from the chassis to the final dissipation to the environment. Only by using such an approach can the deployed system be truly regarded as being optimal.

Ruggedization: Full Environmental Compliance

Ruggedization Level 1 Standard (Air-cooled)
Operating Temperature 0 to +55°C with 300 linear ft./min. airflow
Storage Temperature -50 to +100°C
Vibration 0.002g/Hz from 10 to 2000Hz random and 2g sinusoidal from 5 to 500Hz
Shock 20g peak sawtooth, 11mS duration
Humidity Up to 95% RH
Notes: Commercial grade, for use in benign environments and software development applications.

 

Ruggedization Level 2 Extended Temperature (Air-cooled)
Operating Temperature -20 to +65°C with 300 linear ft./min. airflow
Storage Temperature -50 to +100°C
Vibration 0.002g2/Hz from 10 to 2000Hz random and 2g sinusoidal from 5 to 500Hz
Shock 20g peak sawtooth, 11mS duration
Humidity Up to 95% RH with varying temperature, 10 cycles, 240 hours
Notes: Similar to standard, conformally-coated for added åprotection and temperature characterized.

 

Ruggedization Level 3 Rugged (Air-cooled)
Operating Temperature -40 to +75°C with 600 linear ft./min. airflow
Storage Temperature -50 to +100°C
Vibration 0.04g2/Hz 20 to 2000Hz, with a flat response to 1000Hz, 6dB/octave roll-off from 1000 to 2000Hz
Shock 20g peak saw tooth, 11mS duration
Humidity Up to 95% RH with varying temperature, 10 cycles, 240 hours
Notes: Wide temperature, conformally-coated for added protection. Optional Environment Stress Screening (ESS).

 

Ruggedization Level 4 Rugged (Conduction-cooled)
Operating Temperature -40 to +75°C at the thermal interface
Storage Temperature -50 to +100°C
Vibration Random, 0.1g2/Hz from 15 to 2000Hz per MIL-STD- 810E Fig 514.4 - 8 for high performance aircraft. ~12g RMS
Shock 40g peak saw tooth, 11mS duration
Humidity Up to 95% RH with varying temperature, 10 cycles, 240 hours
Notes: Designed for severe environment applications with high levels of shock and vibration, small space envelope and restricted cooling. Optional Environment Stress Screening (ESS).

 

Ruggedization Level 5 Rugged (Conduction-cooled)
Operating Temperature -40 to +85°C at the thermal interface
Storage Temperature -50 to +100°C
Vibration Random, 0.1g2/Hz from 15 to 2000Hz per MIL-STD- 810E Fig 514.4 - 8 for high performance aircraft. ~12g RMS
Shock 40g peak saw tooth, 11mS duration
Humidity Up to 95% RH with varying temperature, 10 cycles, 240 hours
Notes: Designed for severe environment applications with high levels of shock and vibration, small space envelope and restricted cooling. Optional Environment Stress Screening (ESS).

 

 

Ruggedization on Levels A to E

Abaco Systems has also introduced Ruggediza on Levels A to E which are iden cal in every respect to Ruggediza on Levels 1 to 5 except that the upper opera ng temperature limits are de ned on a product by product basis. This allows Abaco to o er the very highest performance products without the restric ons of xed upper temperature limits. For products rated under this scheme the upper temperature limit is de ned in the product manual.

Level A = Level 1 : except Opera ng Temperature = 0 to X°C (consult manual for X)

Level B = Level 2 : except Opera ng Temperature = -20 to X°C (consult manual for X)

Level C = Level 3 : except Opera ng Temperature = -40 to X°C (consult manual for X)

Level D = Level 4 : except Opera ng Temperature = -40 to X°C (consult manual for X)

Level E = Level 5 : except Opera ng Temperature = -40 to X°C (consult manual for X)

Mil/Aero Thermal Management

To provide the most capable rugged COTS products for demanding environments, thermal challenges must be addressed. Learn how Abaco manages the high power requirements of today's latest technologies and explore the next generation thermal solutions available to maximize embedded computing performance.

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You can benefit not only from our advanced design capability in rugged systems, but also from how we test, test, and test again to ensure market-leading reliability.

 

 

Our comprehensive ISO9001/AS9100-certified development process lowers development costs, reduces non-recurring engineering costs, and substantially cuts system program risks. In addition, project time-to-market is improved because both the Technology Readiness Level (TRL) and Manufacturing Readiness Level (MRL) will be much higher with our subsystem technologies than through the development of analogous proprietary systems.

Our Qualification Test Plan and Qualification Test Report documentation services provide further risk protection for system developers. Typically, the qualification cycle would start with functional testing, followed by thermal cycling, shock, random vibration, thermal vacuum, and electromagnetic radiation tests. An open box inspection would be conducted after completion of testing.

Functional Testing

Several functional tests (FTs) are performed on every product during the qualification test cycle. Although the FT is most frequently an automated process, user intervention may be warranted in some situations.

Shock and Vibration Analysis and Qualifications

Shock and vibration testing simulates qualification-level impacts on the chassis and subassemblies in order to predict potential areas of noncompliance. Our engineers often incorporate this valuable test information into future design modifications.

EMI Qualification

Electromagnetic interference and susceptibility testing on our products is conducted by an approved subcontractor. These tests typically include: electromagnetic compatibility (EC); electromagnetic interference (EMI); electrostatic charge control and dissipation; preclusion of an electromagnetic radiation hazard (EMRADHAZ); and proper electrical bonding for MIL-STD-464.

Thermal Design and Qualification

Sophisticated thermal analysis computer modeling is conducted early in the product design process. These computer simulations evaluate chassis and subassembly performance in worst-case thermal environments. This testing will predict junction temperatures between components, as well as suggest design modifications that would be expected to improve thermal survivability.

Engineering Development Units

After subsystem requirements have been finalized, we can provide engineering development units (EDUs) to facilitate software development in advance of completed subsystem hardware. These EDUs include representative conduction-cooled boards with appropriate connectors or rear translation modules.