Our experience, expertise and patented technologies in cooling don’t just deliver maximum reliability – they allow components to operate at maximum capacity, providing superior performance.
Take our SBC347D 3U VPX single board computer, for example. Abaco’s advanced cooling means it can maintain its maximum rated processor speed – even at temperatures as high as 75C. Advances in processor technologies not only result in increasing power consumption, but also, as device geometries decrease, losses due to leakage currents increase while the surface area of the die from which heat must be extracted decreases. This leads to a need to continually innovate in techniques for extracting heat from devices, boards and systems.
Abaco Systems is uniquely placed to advance the state of the art in thermal management techniques. Advances come from both internal and external research, such as DARPA contracts.
By working on leading edge technologies such as Thermal Ground Planes and Near Junction Cooling of devices as research programs, then transitioning them to deployable implementations, higher power devices can be deployed and junction temperatures can be reduced, leading to better reliability and mean time before failure.
Our engineers take a holistic approach to thermal engineering of a system. We address issues at every stage of heat extraction from the device level, through the board assembly and heatsinking, the thermal interface to the chassis and from the chassis to the final dissipation to the environment. Only by using such an approach can the deployed system be truly regarded as being optimal.