October 2010: Embedded Insider

GE Intelligent Platforms: Embedded Insider eNewsletter
VOLUME 5, ISSUE 4 OCTOBER 2010
 
IN THIS ISSUE
Click here ATCA Adoption by Military
Click here Introducing the First OCTEON™ II- Based Packet Processor
Click here ACR301 Rugged 3U CPCI SBC
arrow 6U OpenVPX CUDA Starter Kit
arrow From Our Library & Upcoming Events
Embedded Insider
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AN INTERVIEW WITH ROY KEELER
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Keeler, Mil/Aero Director of Business Development at GE Intelligent Platforms, discusses why AdvancedTCA is a natural fit for a whole range of military applications.

Q: Is AdvancedTCA really finding its way into military applications? And if so, why?
A: The military relies on communication. Today, that means advanced networks which include everything from tactical radios to live HD video satellite links. And the future of military communication is going to be even more heavily “network-centric.” AdvancedTCA was designed from the ground up for...
   
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Unmmanned VehiclesToday’s military relies on communications and is steadily becoming heavily network-centric. Originally designed for the telecom industry, AdvancedTCA is a proven platform that meets the crucial requirements for military core network applications in benign behind the front line environments. RASM (Reliability, Availability, Serviceability, Manageability) is just one such requirement; ATCA offers a minimum of 99.999% uptime availability, redundancy, field serviceability and robust platform management capabilities. In this interview, Roy

     
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 IP PACKET PROCESSORS
IP Packet Processors
Introducing the First OCTEON™ II- Based Packet Processor
The WANic 6354, based on Cavium Networks’ new OCTEON II CN6335-AAP Application Acceleration processor with 6 cores at 1.1GHz, is ideal for high-volume IP communication networks. This packet processor can be configured to enable a wide variety of applications such as demanding wire-speed communications for secure IP access, network encryption, network monitoring and DPI.
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 SINGLE BOARD COMPUTERS
Single Board Computers
ACR301 Rugged 3U CPCI SBC
Designed to meet requirements of a wide range of applications from industrial through fully rugged Defense and Aerospace programs, the ACR301 combines a choice of four low power Atom E6 series processors up to 1.6 GHz, wide range of I/O options (CR4 IO compatible), PMC on-board expansion slot, extended temperature capability, and a range of air and conduction cooled build levels.
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 DSP & DATA ACQUISITION
CUDA Starter Kit
6U OpenVPX CUDA Starter Kit
6U CUDA Starter Kit shortens time to solution for advanced GPGPU platforms by delivering a flexible, OpenVPX development system complete with all the processor cards, I/O modules and software required to create and demonstrate a deployable platform. GE's OpenVPX GPGPU solutions are ideal for applications that require increased performance in size, weight and power (SWaP) constrained deployed platforms.
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From our library

webcast spacer WEBCAST

Delivering & Deploying Security Gateway Applications

You’re invited to a webinar hosted by NEI, Dell, and
GE to learn about delivering and deploying NEBS application-ready platforms for enhanced
performance, easy deployment, and shortened time
to market. With NEBS-certified application-ready platforms all integration, testing and NEBS certification has been completed for you. As a result, you can focus on creating next-generation security gateways for a sustainable competitive advantage.

get the brochure spacer BROCHURE

xTCA Building Blocks

A modular design usually saves you time, money and regrets. GE offers a broad selection of xTCA products, including ATCA blades and AdvancedMCs, to help you rapidly deploy xTCA systems, and enjoy the benefits of an open modular system design.

webcast spacer WHITE PAPER

Implementing PCI Express Interconnects
in xTCA

Many applications using xTCA form factors can benefit from utilizing the native PCIe interconnect. This paper discusses PCIe technical features and, most
importantly, applications using ATCA and MicroTCA form factors that can benefit from using the native PCIe interconnect.

webcast spacer WHITE PAPER

COM Express for Harsh Environments

COM Express technology now can be deployed into rugged applications previously thought impossible.
This paper discusses the challenges of designing a
COM Express module, specifically the GE Intelligent
Platforms bCOM2-L1100, for deployment in harsh environments of temperature extremes, shock and vibration.
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Upcoming Events
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COM Express Day

November 9, 2010
Table #4
Santa Clara Convention Center
Santa Clara, California

arrowRegister Now! (Free)
 
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Wayne McGee
Commercial Product Mgmt.
GE Intelligent Platforms

Presentation @ 2:40 PM
"Rugged COM Express for Harsh Environments"

Round Table @ 3:20 PM
"Future of COM Express"

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AdvancedTCA Summit

November 10-11, 2010
Booth #309
Santa Clara Convention Center
Santa Clara, California

arrowRegister Now!
    (Special Pricing Code: CCPU)

 
November 11, 2010
• 

Jeff Marden
Sr. Architect & Technologist
GE Intelligent Platforms

Panel Session 201 @ 8:30 AM
"AdvancedTCA and 40Gb Ethernet: A Perspective"

Panel Session 204 @ 2:00 PM
"Top Ten Things You Need to Know About AdvancedTCA and MicroTCA"