TS-IX-LV01

TS-IX-LV01 LVDS I/O Module for use with the TS-PMC series for front panel connectivity to an LVDS source such as CameraLink compliant video source.

TS-IX-LV01

This product reached the end of its lifecycle (end-of-life) on July 7, 2011

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Overview


Designed for the TS-PMC processor, the LVDS Micro Mezzanine module provides up to 32 LVDS I/O connections or 64 single-ended connections. The LVDS I/O can be configured as inputs or outputs as required. If differential and single-ended connections are to be used at the same time, there may be some limitations of valid configurations. This micro mezzanine board can be ordered together with the
TS-DK-ITK software/FPGA development tools that are available to support the hardware.

 

 

  • SCSI3 font panel connection
  • Order as part of the TS-General Purpose Development Kit
  • 32 channels of LVDS I/O for TS-Series of FPGA PMC processor
  • Sensor Processing Resource Center

 

 

Article - Fabric-Based Strategy Doubles Up on UAV Payload Functions (COTS Journal October 2008)

Article - The UAV Video Problem: Using Streaming Video with Unmanned Aerial Vehicles (Military & Aerospace Electronics July 2009)

Article - Joint FPGA-DSP Grab, Squeeze, and Send Effort Sees Video Compression Success (DSP-FPGA.com December 2009)

Specifications

Form Factor
PMC
I/O
LVDS
Chip Set
LVDS Buffers
Conformal Coating
Option
Extended Temperature Range
Yes

Accessories

  • TS-DK-ITK - Complete FPGA development kit for use with the TS-Series of FPGA Processors

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