TS-IX-LV01 LVDS I/O Module for use with the TS-PMC series for front panel connectivity to an LVDS source such as CameraLink compliant video source.


This product entered a Restricted Production Phase (RPP) on July 7, 2011

Please refer to downloads section below if you require documentation or software. If you have any questions or require product support, including help migrating to our latest products, please contact us.
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Designed for the TS-PMC processor, the LVDS Micro Mezzanine module provides up to 32 LVDS I/O connections or 64 single-ended connections. The LVDS I/O can be configured as inputs or outputs as required. If differential and single-ended connections are to be used at the same time, there may be some limitations of valid configurations. This micro mezzanine board can be ordered together with the
TS-DK-ITK software/FPGA development tools that are available to support the hardware.



  • SCSI3 font panel connection
  • Order as part of the TS-General Purpose Development Kit
  • 32 channels of LVDS I/O for TS-Series of FPGA PMC processor
  • Sensor Processing Resource Center



Article - Fabric-Based Strategy Doubles Up on UAV Payload Functions (COTS Journal October 2008)

Article - The UAV Video Problem: Using Streaming Video with Unmanned Aerial Vehicles (Military & Aerospace Electronics July 2009)

Article - Joint FPGA-DSP Grab, Squeeze, and Send Effort Sees Video Compression Success (DSP-FPGA.com December 2009)


Form Factor
Chip Set
LVDS Buffers
Conformal Coating
Extended Temperature Range


  • TS-DK-ITK - Complete FPGA development kit for use with the TS-Series of FPGA Processors

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