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In The News

Using VITA 75 and standards-based modular design to address SWaP-C challenges

By: David Pepper, Product Manager/Technologist, GE Intelligent Platform Military Embedded Systems, December 2014 Issue As the world's armed forces look to deploy computing capability and unmanned vehicles ever closer to the battlefield edge, size, weight, and power (SWaP) are at a premium. The use of modular building blocks such as COM Express (PICMG COM.0) and/or XMC (VITA 42) – and, for packaging, the rugged small form factor (VITA 75) –...

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Digital Image Processing
In The News

Digital Image Processing

By: Charlotte Adams, Contributing Editor, Military Embedded System Military Embedded Systems, November 2014 Issue High-definition (HD) digital electro-optic and infrared sensors are shoveling ever-more data into the battle space. How can soldiers get that information quickly enough to act on it in a timely manner? Intel data traditionally has been the preserve of the higher echelons, while trickle-down information has been the lot of the...

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axis
In The News

Using COTS Software to Reduce HPEC Complexity

EE Catalog, Military & Aerospace - November 2014 By: Chris A. Ciufo, Editor-in-Chief, Embedded; Extension Media Coding for multi-processing HPEC sounds hard, but there are ways to save time and lower risk with slick COTS tools. High-performance embedded computing (HPEC)—the kind that shrinks a super computer into an OpenVPX-sized rugged ATR box—solves the complex problems that power AESA radars, identify buried IEDs from 200 miles up, or...

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GE Provides Customers with New Levels of Performance with Launch of New Single Board Computer
Press Releases

GE Provides Customers with New Levels of Performance with Launch of New Single Board Computer

HUNTSVILLE, AL.—NOVEMBER 25, 2014—GE’s Intelligent Platforms business (NYSE: GE) today announced the SBC314 rugged 3U OpenVPX single board computer. It offers a choice of multicore processor options to enable an optimum performance per watt solution to be deployed in applications such as mission computing and ISR (intelligence, surveillance, reconnaissance). The SBC314 is available with Freescale™’s Power Architecture™ QorIQ™ AMP (advanced...

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Press Releases

GE’s AXISPro Enables Faster, More Cost-Effective Development of Sophisticated Multiprocessor HPEC Applications

HUNTSVILLE, AL.—NOVEMBER 12, 2014—GE’s Intelligent Platforms business (NYSE: GE) today announced Release 6.1 of its AXISPro advanced multiprocessor application development environment. Designed to ease and speed the development of sophisticated applications for advanced high performance embedded computing (HPEC) applications, and so reduce risk and time-to-market, AXISPro now benefits from new features that improve scalability...

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In The News

SWaP sweeps and edge processors adapt

By: Charlotte Adams, Contributing Editor, Military Embedded Systems Military Embedded Systems, October 2014 Issue Size, weight, and power (SWaP) considerations have always been important for embedded electronics, but as platforms shrink, SWaP constraints are becoming ever more critical. Larger platforms will, of course, continue to use “big” processors that are optimized for performance. However, the proliferation of intelligence at...

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GE races to the moon
In The News

A Robot Race on the Moon? At Least One Company Is All In

The space exploration company Astrobotic wants to be your robot’s cheap ticket to the moon. The aerospace innovator is planning to start flying missions there in summer 2016. Its lander-in-development, called Griffin, will have enough room on board to take four robotic rovers and scientific instruments to the lunar surface. On the way, it could also drop off a satellite in the moon’s orbit. Astrobotic is competing with 17 other teams to win the...

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In The News

Video Blog explores how gaming technology influences high performance embedded computing

Military & Aerospace Electronics, October 20, 2014 What can happen when system designers apply digital high-end gaming technology military embedded computing? The answer is a lot, as technologies such as general-purpose graphics processors (GPGPUs) - designed originally for gamers - yield space and power-efficient parallel processing capability. Military & Aerospace Electronics Chief Editor John Keller talked with Dustin Franklin of GE...

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GE Announces First Sub-Credit Card-Sized Multi-Function High Definition (HD) Video Tracker
Press Releases

GE Announces First Sub-Credit Card-Sized Multi-Function High Definition (HD) Video Tracker

HUNTSVILLE, AL.— OCTOBER 13, 2014—GE’s Intelligent Platforms business today announced at AUSA (October 13-15, Walter E. Washington Convention Center, Washington DC) the rugged ADEPT4000 compact high definition digital video tracker with electronic image processing. It is the first HD digital video tracker with the capability to perform tracking, image stabilization and video compression simultaneously in a cost-effective...

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Press Releases

GE Receives Order from BAE Systems for 3U VPX Rugged Systems That Deliver High Performance Embedded Computing (HPEC) Capability

HUNTSVILLE, AL.—October 13, 2014—GE’s Intelligent Platforms business (NYSE: GE) today announced at AUSA (October 13-15, Walter E. Washington Convention Center, Washington DC) that it had received a $2.6 million order from BAE Systems Platforms and Services for a quantity of its latest generation 3U VPX COTS Rugged Systems that deliver an advanced HPEC (High Performance Embedded Computing) capability. The COTS Rugged Systems...

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In The News

Stepping up to the ISR Challenge with PCI Express

EE Catalog - September, 2014 By: David Tetely and Simon Furlong, GE Intelligent Platforms High speed serial switched fabrics such as InfiniBand and Serial RapidIO have garnered significant attention in recent years—to the point where it’s become easy to think of PCI Express as "just for consumer PCs." In fact, nothing could be further from the truth. Implemented appropriately, it delivers numerous advantages. In fact, it is now...

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thermal management
In The News

The Cutting Edge of Thermal Management

By: Brian Hoden, Principal Mechanical Engineer, Embedded Engineering at GE Intelligent Platform Military Embedded Systems, September 2014 Issue The biggest challenge for system integrators today is thermal management. With access to the latest-generation processors, GPUs, and switch fabrics, system integrators must find creative ways to remove the heat created by this vast computing power. These thermal challenges call for innovative thermal...

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In The News

Aerospace and defense missions require rugged data networking

Military & Aerospace Electronics, September 2014 Issue ~ Interview with Rubin Dhillon, Global Marketing Director for GE Intelligent Platforms Military organizations look to outfit myraid vehicles with compact, yet feature-rich networking equipment able to withstand harsh environments. READ FULL ARTICLE

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In The News

Navy orders PMC daughter cards from GE for shipboard aircraft approach and landing system

Military & Aerospace Electronics, September 5, 2014 By: John Keller, Editor U.S. Navy air-traffic control experts needed data-transfer embedded computing cards for the Joint Precision Approach and Landing System (JPALS). They found their solution from GE Intelligent Platforms in Huntsville, Alabama. READ FULL ARTICLE

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Press Releases

GE Intelligent Platforms Receives $1.5m Order from Spain’s Sainsel to Enable New Equipment for Mission Systems

HUNTSVILLE, AL.—SEPTEMBER 02, 2014—GE Intelligent Platforms (NYSE: GE) today announced that it has received orders from Sainsel Sistemas Navales of Madrid, Spain for a range of GE’s rugged embedded computing systems that will be deployed as part of Sainsel’s aeronautics program. GE’s boards will be used in new equipment developed by Sainsel as part of a mission system. Initial value of the order is $1.5 million; long term value is expected to be...

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